ANKE Circuits Capacity

Material:

FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers

Number of layers:

1-28 layers

Out layer Cu thickness:

1-6OZ

Inner layer Cu thickness:

1-4OZ

Maximum processing area:

610*1100mm

Minimum board thickness:

2 layers 0.3mm (12mil)

4 layers 0.4mm (16mil)

6 layers 0.8mm (32mil)

8 layers 1.0mm (40mil)

10 layers 1.1mm (44mil)

12 layers 1.3mm (52mil)

14 layers 1.5mm (59mil)

16 layers 1.6mm (63mil)

Minimum Width:

0.076mm (3mil)

Minimum Space:

0.076mm (3mil)

Minimum hole size (final hole):

0.2mm

Drilling hole size:

0.2-0.65mm

Drilling tolerance:

+\-0.05mm(2mil)

PTH tolerance:

¦µ0.2-1.6mm +\-0.075mm (3mil)

¦µ1.6-6.3mm+\-0.1mm(4mil)

NPTH tolerance:

¦µ0.2-1.6mm +\-0.05mm(2mil)

¦µ1.6-6.3mm+\-0.05mm(2mil)

Finish board tolerance:

Thickness£¼0.8mm, Tolerance:+/-0.08mm

0.8mm¡ÜThickness¡Ü6.5mm,Tolerance+/-10%

Minimum soldermask bridge:

0.076mm (3mil)

Twisting and bending:

¡Ü0.75% Min0.5%

Raneg of TG:

130-215¡æ

Impedance tolerance:

+/-10%£¬Min+/-5%

Surface Treatment:

HASL, LF HASL

Immersion Gold, Flash Gold,Gold finger

Immersion Silver, Immersion Tin,OSP